Diamond wire cutting technology produces ultra-thin monocrystalline silicon wafers

Abstract After three months of technical research and development and testing, Jinkui Energy has produced ultra-thin single crystal silicon wafers with a thickness of only 145um, becoming the only supplier of 145um ultra-thin silicon wafers in China. Jiangxi Jinkui Energy Technology Co., Ltd. is the leading domestically used King Kong with high efficiency and environmental protection...
After three months of technical research and development and testing, Jinkui Energy has produced ultra-thin monocrystalline silicon wafers with a thickness of only 145um, making it the only supplier of 145um ultra-thin wafers in China.

Jiangxi Jinkui Energy Technology Co., Ltd. is the leading enterprise in China that produces photovoltaic wafers using high-efficiency green and environmentally friendly diamond wire cutting technology. In March 2011, it entered the domestic market and was the first to introduce diamond wire-cut silicon wafers. The product quality and performance have even reached More than ordinary mortar silicon.

Since August 2012, Jinkui Energy has been committed to improving the diamond wire-cutting process and testing 145um ultra-thin wafers with success. The wafer center thickness is 145±15um, TTV is less than 25um, and WARP is less than 40um. After several large-scale battery manufacturers' samples, the surface quality and electrical performance of the battery sheets have reached the quality requirements of similar products, and the fragmentation rate has maintained a normal level.

Thinning is one of the trends in the photovoltaic wafer industry in recent years. At present, the thickness of common mortar silicon wafer is generally around 200um. By reducing the thickness to 145um, the number of sheets per kilogram can be increased by 7-9 pieces. A 10% drop in cost per watt can be reduced by about 0.2 cents, which has very significant economic and social significance.

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